Background
Wherever heat is generated in electronic components as a result of power loss, this must also be dissipated in order to prevent the components from overheating. In the state of the art, there are many applications that benefit from an increased heat flow between two surfaces. Especially in spacecraft, where convection cannot take place due to environmental conditions, conducted heat transport between two surfaces is crucial. However, with all known methods, the possible achievable contact area or its shape is limited. To increase thermal conduction between two surfaces, various "Thermal Interface Materials (TIMs)" have been developed so far, which are filled into the gaps and are not reusable (e.g. thermally conductive gels, pastes or others).
Technical Description
The invention relates to a method for producing a composite material (metals and carbon), a composite material and a use of the composite material as a heat conductor as well as a heat exchanger. It enables an increase in the interface area and/or contact area of a redetachable and reusable thermal interface, thereby increasing the heat flow between two surfaces. The production of thermal interfaces with a larger contact area and any shape enables further fields of application.
Possible Applications
Aerospace, electrical engineering, electronics, microsystems technology, mechanical engineering
More complex embodiment example of a composite material, which here consists of two layers of different materials. A third section may be located below the composite and have a lower thermal conductivity than the composite of the first section. The fourth section can have the same or preferably higher thermal conductivity, whereby the heat is dissipated laterally. (© TU Berlin)
